THERMAL MATERIALS TO SUIT YOUR APPLICATION
SHOW PREVIEW 2023
Our 2023 Show Preview will provide you with a taste of what's on offer at this year's event. Thermal Materials to suit your application, is one of the three themes we are previewing.
'I am looking forward to seeing the breadth of innovative thermal management strategies being presented by large material players and smaller start-ups alike. So many different industries require thermal management and associated materials with different properties for each application.'
Yulin Wang, IDTechEx
To ensure you don't miss out on seeing the latest products and technologies being showcased, you can register for free to secure your pass to Thermal Management Expo 2023.
Keynote: Advances in Thermal Interface Materials (TIM)
9:30am, Wednesday May 3
This session will explore...
The challenges of balancing key properties of thermal interface materials
Testing materials to guide development and establish suitability for customer evaluation
Advances in testing the heat transfer properties of these materials in use
Applications and requirements for use in advanced packaging
PREVIEW OUR EXHIBITION FLOOR
Check out some of the products and technologies being showcased on the exhibition floor ahead of the day!
Showcasing... Measurement Platform (MP-1)
Thermtest Inc.
Booth 506
The versatile MP-1 combines multiple methods to measure the absolute thermal conductivity, thermal diffusivity and specific heat of solids, liquids, pastes and powders.
The methods available are transient plane source, transient hot wire, transient line source and transient hot strip with testing. The abilities of the MP-1 are greatly expanded with the addition of Thermtest’s proprietary Temperature Platform (TP) which is appreciated by academic and commercial users alike.
Industries: Automotive | Aerospace & Defense | Electronics | Energy | Medical | Telecoms
Showcasing... VT-4BC Metal Base Laminate
Ventec International Group
Booth 807
VT-4BC: a high thermal conductive metal base laminate designed for use in applications requiring excellent performance in thermal management including super bright lighting, power modules, controllers, motor drives and rectifiers. With high electrical breakdown strength, VT-4BC is designed to provide unparalleled reliability. It exhibits a thermal conductivity of 10 W/mK, offering superior heat dissipation even under the most demanding conditions. VT-4BC also boasts excellent mechanical properties, dimensional stability, and superior dielectric properties. It is resistant to impact, moisture, and chemicals, making it a reliable choice for the most demanding applications particularly for IGBT and power markets.
Industries: Automotive | Aerospace & Defense | Energy | Medical | IGBT & Power Markets
FANCY A QUICK READ ON YOUR COFFEE BREAK?
Blog: NEW TEST STANDARD TIM AND IMS MATERIALS TO ENABLE SIDE-BY-SIDE COMPARISON
Global electronics association IPC has published a new method for testing thermal properties of materials. The standard should finally give designers and thermal engineers a way to compare multiple technical data sheets side-by-side. Will IPC TM-650-2.4.54 replace ASTM D5470?
Changing the Game with Phase Change Materials (PCM)
10:00am, Wednesday May 3
Phase Change Materials (PCM) have become a key part in many thermal management systems, in batteries in particular. What is the chemistry behind these solutions and how are they applied in electric vehicles? This session will examine two cases of game-changing PCMs.
PREVIEW OUR EXHIBITION FLOOR
View our full exhibitor list, including the booths you'll find at co-located Ceramics Expo.
Showcasing... CGW (Thermal Gap filler)
Sekisui Chemical
Booth 823
Sekisui CGW (Thermal Gap filler) is one of the leading material technologies to solve your thermal challenges, especially with our experiences and expertise, we even helped our current customers to optimize productivity.
Industries: Automotive | Electronics | Energy | Telecoms
Hear what IDTechEx's Technology Analyst, Yulin Wang says are one of the key challenges with TIMs ahead of their session
"While many TIMs such as graphite, carbon-based TIMs or metal-based TIMs have demonstrated superior in-plane (x-y) and through-plane (z) thermal conductivities, they have limited thermal performance because of the poor contact. The filler materials typically have high thermal conductivities with high Young’s modulus (limited conformability) and costs. On the contrary, the matrix materials have great flexibility and costs but limited conductivities. Therefore, choosing the right TIM would be a trade-off between thermal conductivities, conformability and costs."
Presentation: Optimizing the Thermal Management of Diamond Heat Spreaders
11:30am, Wednesday May 3
This session addresses the thermal performance of CVD diamond heat spreaders in cooling real applications, comparing modelling simulations with actual experimental measurements, using various diamond grades and diamond and bond-layer thicknesses.
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With all of that and so much more, it just takes 5 minutes to register for free and experience two days of thought-provoking idea-sharing and product and technology showcases.
