Exhibition Showcase
Encounter the next big technologies at the thermal management industry's must-attend event for your 2024 calendar.
Below is just a taste of the products and exhibiting companies that you will find on the show floor.
T-Global's TG Putty Series (Thermal Putty)
Thermal putty is a product that provides excellent thermal conductivity and efficient heat dissipation. It falls between thermal grease and thermal pad in terms of hardness, offering higher reliability than thermal grease and lower thermal impedance than thermal pads. T-Global’s TG Thermal Putty Series has a slight adhesive property, making it suitable for various electronic products and heat-dissipation devices. Utilizing advanced thermal materials, it boasts excellent thermal conductivity, ensuring optimal performance of the heat dissipation system. Its soft texture allows for easy application and filling.
Visit booth 400
James Hopkins, National Sales Manager
Evosys present the EVOWELD Mini
Evosys offers high-end technology for flexible solutions in laser plastic welding. We can offer support in areas of material feasibility testing, product design and development, all the way to serial production. We separate ourselves from the competition because of our global support & service for our customers. We are the #1 innovative company in this industry that offers the most flexible solutions in this industry. Find out more about the EVOWELD mini here.
Visit booth 705
George Tank, Sales Manager
Empower Materials Inc. is proud to promote QPAC® 40 Polyalkylene carbonate
QPAC® is a CO2 based polymer used in many demanding binder/temporary adhesive applications. QPAC® cleanly decomposes at low temperatures into CO2 and water in many different atmospheres. It leaves very little organic residue upon decomposition. At the same time it offers excellent adhesion and green properties.
QPAC® is used in many demanding technical applications. This includes as a binder in thermal transfer applications for many electronic parts. Applications include tape casting, paste formulations, pressed parts and coatings. Find out more about Empower materials here.
Visit booth 404
Alloy Enterprises reveal their Aluminium Cold Plate
Alloy Enterprises aluminium cold plate components feature high conductivity, channel complexity, integrated cooling, and conformal surfaces. Benefits include customizable design, quick turn iterations, reduced assembly, and optimal thermal management performance. Check out the product here.
Visit booth 505
Ali Forsyth, Ph.D., CEO, Alloy Enterprises
Burger Group is proud to promote Smart Actuators for thermal management systems and coolant control valves
Burger Group's smart actuators allow easy integration with thermal management valves and modules. Their products offer smart functionality, position control and diagnostics. Standard or customized with onboard PCB and software in DC and BLDC versions. Find out more aboutwhat Burger Group do here.
Visit booth 702
Rob Learmonth, Senior Manager, Burger Group
Diabatix's ColdStream
Diabatix ColdStream is a cloud-based platform that enables users to analyze or apply generative design to thermal and flow problems. Whether for automotive, high-performance computing, consumer goods or any other product, generative design can push thermal boundaries to the limit, meeting design targets and manufacturing requirements. ColdStream platform saves 80% of the engineering time and gains 20% cooling performance while experiencing the most optimal user experience. Check out a video demonstration here.
Visit booth 511
Steven Baeyens, Chief Commercial Office, Diabatix
Momentive Technologies present their Boron Nitride as a filler for TIM applications in EV
Boron Nitride (BN) is a superior ceramic filler solution for thermal interface materials in a variety of applications. BN offers a unique combination of properties, including high thermal conductivity, high electrical resistivity, high break down strength, low dielectric constant, and low density compared to other ceramic fillers. Find out more about what Momentive Technologies do here.
Visit booth 616
Dr. Xiang Liu, Director, Global Product Management, Momentive Technologies
TCLAD's Range of Thermal Management Solutions
TCLAD’s portfolio of thermal management solutions including insulated metal substrate laminates and custom bare board circuits, thermal interface materials including silicone, epoxy and fluorine pads and liquids, and surface mounted thermal bridge components, provides a “one-stop-shop” for design engineers. TCLAD also provides robust electrical performance for high voltage applications, like automotive OBC and DC-DC power converters, and defense and aerospace power conversion modules. In addition to automotive and defense and aerospace applications, TCLAD also proudly supports industrial, medical, semiconductor, and commercial markets with their thermal management solutions.
Visit booth 716